DescriptionBisphenol F (BPF) is an epoxy based resin that can be used as an engineering polymer. It has a low viscosity, high thermal stability and chemical resistance. It can be used in anticorrosive coatings and epoxy based adhesives. It can be cured by using amine and anhydride based hardeners. It has an epoxy value of 0.549 mol/100g.BPF is a resin that can be used in the development of high strength materials in aircrafts and electronic products. It can form a variety of engineering plastics for industrial applications.Epoxy curative with good thermal properties.StableLow viscosityDoes not impede free radical cureThermoset adhesivesCurative for epoxy/(meth) acrylate hybridsHybrid epoxy/free radical thermosets. Molecular Formula: C19H22O4. Molecular Weight: 314.4. PubChem CID: 154824842. Related Document: https://ald-pub-files.oss-cn-shanghai.aliyuncs.com/aladdinsci/pdp/sds/1/B486516-SCI_5ac8ae2715978ca3dccb846084c444d5.pdf.
- UPC:
- 12352401
- Condition:
- New
- Availability:
- 8-12 weeks
- Weight:
- 4.27 Ounces
- HazmatClass:
- No
- WeightUOM:
- LB
- MPN:
- B486516-25g
- CAS:
- 1044764-71-7
- Product Size:
- 25g
- Hazard Statement Codes:
- H302:H319
- Precautionary Statement Codes:
- P264:P270:P280:P330:P301+P312:P305+P351+P338:P501
