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C345614-1gCopper oxychloride has been used as an agricultural fungicide, a pigment in pyrotechnics, and as a catalyst.
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C335850-100gProduct Application:Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to
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C335850-25gProduct Application:Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to
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C335850-5gProduct Application:Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to