General description
Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Ã… of titanium followed by 1000Ã… of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.
Application
Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.
Packaging
Packaging 1 set in single wafer shipper
Molecular Weight: 196.97. Empirical Formula: Au. linearFormula: Au. Quality Level: 100. Assay: 99.99% (Ti), 99.999% (Au). diam. × thickness: 4 . in. × 500 . μ. m . layer thickness: 1000 . Ã… . matrix attachment: Titanium, as adhesion layer used to bind the gold to the silicon wafer.. SMILES string: [Au]. InChI: 1S/Au. InChI key: PCHJSUWPFVWCPO-UHFFFAOYSA-N. Storage Class Code: 11 - Combustible Solids. WGK: WGK 3. Flash Point(F): Not applicable. Flash Point(C): Not applicable.- UPC:
- 41100000
- Condition:
- New
- Weight:
- 1.00 Ounces
- HazmatClass:
- No
- WeightUOM:
- LB
- MPN:
- 643262-1EA