Skip to main content

High speed bright copper electroplating solution (C15-1311-713)

Sigma-Aldrich

Catalog No.
C15-1311-713
Manufacturer No.
900569-500ML
Manufacturer Name
Sigma-Aldrich
Quantity
500
Unit of Measure
ML
Price: $164.36
List Price: $182.62

High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including

Enjoy exclusive benefits including discounted pricing on orders by contacting our Sales Executives to open an account.

Adding to cart… The item has been added

General description

High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. The organic additives have a wide concentration process window eliminating the need for separate additive solutions and replenishment for about 120 Amp-hours of electroplating.

Features and Benefits

  • The use of single electroplating solution containing plating additives.
  • Stable additives with large process window.
  • High purity electrolyte and long shelf life.
  • High cloud point (>80 °C) and low foaming.
  • Low surface tension plating bath (∼44 dyne/cm @ 25 °C).
  • High speed plating (Up to 5 μm/min).
  • Uniform and flat bumps, pads, patterns and redistributions layers.
  • Void free filling of vials and trenches.

Quality

Deposits characteristics:

  • Density of 8.9 g/cm3.
  • Electrical resistivity of 1.7–1.8 μΩ cm.
  • Stress <50 MPa.
  • High in-film purity (<10 ppm for N, S, C, O, Cl).
  • Low surface roughness, RMS <10 nm @ 1 μm thick Cu.
  • Planarization of trenches (no recess in 1 μm wide x 0.5 μm deep trenches with 0.8 μm thick Cu).
  • Strong (111) texture with small (220) and (200).
  • Reflectivity >75%.
  • Elongation of 19–32%.

grade: semiconductor grade. Quality Level: 100. form: liquid. concentration: 40 . mg/L±4 . mg/L chloride, 600 . mg/L±60 . mg/L (organic additives), 65.0 . g/L±2 . g/L Cu, 8.0 . g/L±0.4 . g/L H2SO4. Pictograms: GHS05,GHS07,GHS09. Signal Word: Warning. Hazard Statements: H290 - H302 - H315 - H319 - H410. Precautionary Statements: P273 - P301 + P312 + P330 - P302 + P352 - P305 + P351 + P338. Hazard Classifications: Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 1 - Eye Irrit. 2 - Met. Corr. 1 - Skin Irrit. 2. Storage Class Code: 8B - Non-combustible, corrosive hazardous materials. WGK: WGK 3. Flash Point(F): Not applicable. Flash Point(C): Not applicable.
UPC:
41116105
Condition:
New
Weight:
1.00 Ounces
HazmatClass:
No
WeightUOM:
LB
MPN:
900569-500ML


Cenmed Satisfaction Guarantee

At Cenmed, your confidence and satisfaction are paramount. We guarantee the quality and reliability of our extensive range of clinical and laboratory supplies. If you're not completely satisfied with your purchase, we offer a straightforward return process and dedicated support to resolve your concerns promptly. Our commitment ensures that you can order with confidence, knowing that Cenmed is dedicated to superior service and customer satisfaction. Trust us to meet your needs with every order, backed by our promise of excellence. Learn more in Help & FAQs.


"Cenmed provides me access to the same products/services normally reserved for much larger labs than mine. I was presently surprised by their product offering."

LAB DIRECTOR


"We utilized Cenmed's capabilities for a variety of projects around the world. They are a valued partner and supplier."

PHARMACEUTICAL SUPPLY CHAIN LEADER


"The reps are very good at finding products for customers in this period of supply chain issues."

SCOTT BEHMAN


"Your customer service has been excellent and makes me excited about purchasing with Cenmed in the future!!"

PROCUREMENT + BILLING COORDINATOR AT PHARMA.