Electronic Chemicals & Etchants

DescriptionLinker molecule for conjugation of biomolecules to graphene.}.

DescriptionCharacteristics of Parylen AF4 coating:Specialties:Unmatched UV stabilityExcellent thermal stability at high service temperature (350)Unmatched oxidation stabilityCompletely conformal coatingSuperior crevice penetration, pin hole

DescriptionCharacteristics of Parylen AF4 coating:Specialties:Unmatched UV stabilityExcellent thermal stability at high service temperature (350)Unmatched oxidation stabilityCompletely conformal coatingSuperior crevice penetration, pin hole

DescriptionCharacteristics of Parylen AF4 coating:Specialties:Unmatched UV stabilityExcellent thermal stability at high service temperature (350)Unmatched oxidation stabilityCompletely conformal coatingSuperior crevice penetration, pin hole

DescriptionLinker molecule for conjugation of biomolecules to graphene.}.

It is used to control excessive sweating. It is commonly used as a catalyst for the halogenation (especially chlorination) of aromatic groups, as well as in the Friedel Crafts reaction. It is also used in the Meerwein-Ponndorf-Verley reduction. It

It is used to control excessive sweating. It is commonly used as a catalyst for the halogenation (especially chlorination) of aromatic groups, as well as in the Friedel Crafts reaction. It is also used in the Meerwein-Ponndorf-Verley reduction. It

DescriptionALUMINUM ETCHANT - TYPE AStandard aluminum etchant for use on silicon devices and other microelectronic applications.Aluminum etchants are stable, non-toxic preparations used to etch aluminum metallizations on silicon devices and in

DescriptionALUMINUM ETCHANT - TYPE DStandard aluminum etchant for use on gallium arsenide, arsenide and gallium phosphide devices and for aluminum metallizations on nichrome resistorsAluminum etchants are stable, non-toxic preparations used to etch

DescriptionAluminum Etchant Type F is a stable preparation used to etch aluminum or aluminum-silicon metallizations on silicon devices and in integrated circuit applications. Aluminum contacts are defined and interconnections are formed. Aluminum

DescriptionEthylenediamine based - for &lt: 100 &gt: crystal orientationEtch rate ~80microns/hour at @ 100 °C. Etches cleanly with only a deionized water rinse needed. Will not etch Au or Ta.

ApplicationBarium molybdenum oxide is used in electronic and optical equipment, pigment in paints and other protective coatings. It is also used as enamel of the adhesive products for iron's adhesion strong.