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L7071
B BRAUN ISOLYTE MULTI-ELECTROLYTE IV SOLUTIONS IN EXCEL BAG (C001B-028513)
Price: $325.88List Price: $362.09500mL Isolyte S pH 7.4 Injection (Rx) (Item is Non-Returnable), 24/cs (Continental US+HI Only, Excluding IN and ND) -
E487528-100ml
EL-HPE high performance electrolyte (C007B-155897)
Price: $1,542.04List Price: $1,713.38DescriptionEL-HPE High Performance Electrolyte is a low viscosity, high ionic conductivity liquid electrolyte, and, therefore, provides highest performance.Due to the low boiling point of the main solvent and the chemistry of the electrolyte -
E487528-10ml
EL-HPE high performance electrolyte (C007B-155898)
Price: $300.36List Price: $333.73DescriptionEL-HPE High Performance Electrolyte is a low viscosity, high ionic conductivity liquid electrolyte, and, therefore, provides highest performance.Due to the low boiling point of the main solvent and the chemistry of the electrolyte -
E487528-50ml
EL-HPE high performance electrolyte (C007B-155899)
Price: $1,195.42List Price: $1,328.24DescriptionEL-HPE High Performance Electrolyte is a low viscosity, high ionic conductivity liquid electrolyte, and, therefore, provides highest performance.Due to the low boiling point of the main solvent and the chemistry of the electrolyte -
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33785S-2L
ELECTROLITE SOLUTION FOR MEDICAL TECHNOL
Price: $7.08List Price: $7.86ELECTROLITE SOLUTION FOR MEDICAL TECHNOL -
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74923
Electrolyte Solution, ASTM D3227 6.9.1, 1L
Price: $193.82List Price: $215.36Specific Gravity: 0.790 -
74922
Electrolyte Solution, ASTM D3227 6.9.1, 4 X 4L
Price: $1,217.05List Price: $1,352.28Specific Gravity: 0.790 -
74921
Electrolyte Solution, ASTM D3227 6.9.1, 4L
Price: $385.30List Price: $428.11Specific Gravity: 0.790 -
C13001
Electrophoretic Tissue Clearing Solution
Price: $1,736.67List Price: $1,929.63Electrophoretic Tissue Clearing Solution -
H475915-100ml
High speed bright copper electroplating solution
Price: $115.79List Price: $128.65High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including