BUFFERED OXIDE ETCHANT (BOE) 6:1 WITH SURFACTANT (C005B-235918)

General description

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

Application

Buffered oxide etchant (BOE) 6:1 with surfactant may be used in the oxide removal of AlGaN/GaN-based high electron mobility transistors for gate photolithography. It may also be used in a buffer oxide etchant method for the fabrication of micro biochip.

form: liquid. Pictograms: GHS05,GHS06. Signal Word: Danger. Hazard Statements: H300 + H310 + H330 - H314. Precautionary Statements: P260 - P270 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338. Hazard Classifications: Acute Tox. 1 Dermal - Acute Tox. 2 Inhalation - Acute Tox. 2 Oral - Eye Dam. 1 - Skin Corr. 1A. Storage Class Code: 6.1B - Non-combustible, acute toxic Cat. 1 and 2 / very toxic hazardous materials. WGK: WGK 2. Flash Point(F): Not applicable. Flash Point(C): Not applicable.

Shipping Information:

Hazmat Fee: $65.00 + applicable shipping charges are added after the order is placed.

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UPC:

12352310

Condition:

New

Weight:

1.00 Ounces

HazmatClass:

Yes

Quantity:

1

Unit of Measurement:

LI

MPN:

901623-1L