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T434182-25mlApplicationTetraethyl orthosilicate (TEOS) is an oxygen containing precursor of Si used for the deposition of: Si oxide Oxycarbide Doped silicate Silanol Siloxane polymer Organosilicon thin films The films can be deposited at low temperatues
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S300081-100mgProduct Describtion:Tetrakis(bromophenyl) silane is an intermediate for emerging hole transport materials based on a silicon core. Materials containing this core have been shown to compete with SpiroMeOTAD for efficiency and stability in perovskite
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S300081-1gProduct Describtion:Tetrakis(bromophenyl) silane is an intermediate for emerging hole transport materials based on a silicon core. Materials containing this core have been shown to compete with SpiroMeOTAD for efficiency and stability in perovskite
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S300081-500mgProduct Describtion:Tetrakis(bromophenyl) silane is an intermediate for emerging hole transport materials based on a silicon core. Materials containing this core have been shown to compete with SpiroMeOTAD for efficiency and stability in perovskite
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S300081-5gProduct Describtion:Tetrakis(bromophenyl) silane is an intermediate for emerging hole transport materials based on a silicon core. Materials containing this core have been shown to compete with SpiroMeOTAD for efficiency and stability in perovskite
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T475149-10gDescriptionAtomic number of base material: 72 Hafnium.
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T486525-5gTetrakis(diethylamido)tin(IV).
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T432722-25gGeneral DescriptionPlease inquire for bulk quantity, pricing, and packaging options.ApplicationPrecursor to titanium nitride (TiN) thin films by organometallic chemical vapor deposition (OMCVD).
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T432722-5gGeneral DescriptionPlease inquire for bulk quantity, pricing, and packaging options.ApplicationPrecursor to titanium nitride (TiN) thin films by organometallic chemical vapor deposition (OMCVD).
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T432723-10gGeneral DescriptionAtomic number of base material: 22 TitaniumApplicationPrecursors Packaged for Depositions Systems.
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T432724-5gTetrakis(diethylamido)titanium(IV).
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T432281-25gGeneral DescriptionPlease inquire for bulk quantity, pricing, and packaging options.